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器件3D模型￥ 15.679
LAN9500AI-ABZJ-TR 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
接口芯片
封装:
QFN-56
描述:
以太网控制器, 100 Mbps, IEEE 802.3, IEEE 802.3u, 3 V, 3.6 V, QFN, 56 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P11P22P111Hot
典型应用电路图在P112
原理图在P7P25P101P103
封装尺寸在P207
封装信息在P1P207P208P211
功能描述在P1P25P58
技术参数、封装参数在P193P195P204P205P206
应用领域在P1P168
导航目录
LAN9500AI-ABZJ-TR数据手册
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若手册格式错乱，请下载阅览PDF原文件
2010 - 2015 Microchip Technology Inc. DS00001875A-page 11
LAN950x
3.0 PIN DESCRIPTION AND CONFIGURATION
Note 1: ** This pin is a no-connect (NC) for LAN9500A/LAN9500Ai, but may be connected to VDD33A for backward
compatibility with LAN9500/LAN9500i.
2: *** For LAN9500A/LAN9500Ai this pin provides additional PME related functionality. Refer to the respective
pin descriptions and Section 6.0, "PME Operation," on page 112 for additional information.
3: **** For LAN9500A/LAN9500Ai GPIO7 may provide additional PHY Link Up related functionality. Refer to
Section 5.12.2.4, "Enabling PHY Link Up Wake Events (LAN9500A/LAN9500Ai ONLY)," on page 108 for
additional information.
4: When HP Auto-MDIX is activated, the TXN/TXP pins can function as RXN/RXP and vice-versa.
5: Exposed pad (VSS) on bottom of package must be connected to ground.
FIGURE 3-1: PIN ASSIGNMENTS (TOP VIEW)
VSS
LAN950x
56 PIN QFN
(TOP VIEW)
TXEN
RXDV
nSPD_LED/GPIO10 ***
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
42
41
40
39
38
37
36
35
34
33
32
31
30
29
56
55
54
53
52
51
50
49
48
47
46
45
44
43
TEST2
USBDP
USBDM
VDDPLL
VDD33A
EXRES
VDD33A **
RXP
RXN
VDD33A
TXP
TXN
nPHY_INT
RXCLK
TDI/RXD3
TMS/RXD2
TCK/RXD1
TDO/nPHY_RST
nTRST/RXD0
VDD33IO
PHY_SEL
TEST3
EEDI
EEDO/AUTOMDIX_EN
EECS
EECLK/PWR_SEL
RXER
CRS/GPIO3
COL/GPIO0 ***
TXCLK
VDD33IO
TEST1
VDDCORE
VDD33IO
VDD33IO
TXD3/GPIO7/EEP_SIZE ****
TXD2/GPIO6/PORT_SWAP
TXD1/GPIO5/RMT_WKP
TXD0/GPIO4/EEP_DISABLE
nLNKA_LED/GPIO9 ***
nFDX_LED/GPIO8 ***
VDD33IO
nRESET ***
MDIO/GPIO1 ***
MDC/GPIO2
VDDCORE
VBUS_DET ***
XO
XI
VDDUSBPLL
USBRBIAS
VDD33A
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