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LM393DT 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
比较器
封装:
SOIC-8
描述:
STMICROELECTRONICS LM393DT 模拟比较器, 双路, 电压, 2, 1.3 µs, 2V 至 36V, SOIC, 8 引脚
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3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P10
原理图在P1P9
封装尺寸在P14P15P16P17P18P19P21P22P23P24
标记信息在P14P15P16P17P18P19
封装信息在P13P14P15P16P17P18P19P20P21P22P23P24
技术参数、封装参数在P4
应用领域在P1P20P25
电气规格在P5P6P7
导航目录
LM393DT数据手册
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LM193
,
LM293
,
LM293A
,
LM393
,
LM393A
,
LM2903
,
LM2903V
SLCS005Y –OCTOBER 1979–REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage
(2)
36 V
V
ID
Differential input voltage
(3)
±36 V
V
I
Input voltage (either input) –0.3 36 V
V
O
Output voltage 36 V
I
O
Output current 20 mA
Duration of output short circuit to ground
(4)
Unlimited
T
J
Operating virtual-junction temperature 150 °C
Case temperature for 60 s FK package 260 °C
Lead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °C
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
1000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
(non-V devices) 2 30 V
V
CC
(V devices) 2 32 V
T
J
Junction Temperature –40 125 °C
6.4 Thermal Information
LMx93, LM2903
PW
DGK PS JG FK
THERMAL METRIC
(1)
D (SOIC) P (PDIP) (TSSO UNIT
(VSSOP) (SO) (GDIP) (LCCC)
P)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS
R
θJA
Junction-to-ambient thermal resistance 97 172 85 95 149 — — °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance — — — — — 14.5 5.61 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4 Submit Documentation Feedback Copyright © 1979–2015, Texas Instruments Incorporated
Product Folder Links: LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
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