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器件3D模型￥ 18.444
LMH6643MM/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
MSOP-8
描述:
Texas Instruments
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4Hot
典型应用电路图在P22P23P24
原理图在P21
封装尺寸在P27P29P30
标记信息在P27P28
封装信息在P26P27P28P29P30
焊接温度在P5
技术参数、封装参数在P5P21P23
应用领域在P1P39
电气规格在P5P6P7P8P9P10P11P12P13P14P15P16
导航目录
LMH6643MM/NOPB数据手册
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LMH6642
,
LMH6643
,
LMH6644
www.ti.com
SNOS966Q –MAY 2001–REVISED SEPTEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IN
Differential ±2.5 V
Output Short Circuit Duration See
(3)
and
(4)
Supply Voltage (V
+
- V
−
) 13.5 V
V
+
+0.8
Voltage at Input/Output pins V
V
−
−0.8
Input Current ±10 mA
Junction Temperature
(5)
+150 °C
Infrared or Convection Reflow (20 sec) 235 °C
Soldering Information
Wave Soldering Lead Temp.(10 sec) 260 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) Output short circuit duration is infinite for V
S
< 6V at room temperature and below. For V
S
> 6V, allowable short circuit duration is 1.5ms.
(5) The maximum power dissipation is a function of T
J(MAX)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ R
θJA
. All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range −65 +150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, 2000
all pins
(2)
Electrostatic
V
(ESD)
Machine model (MM)
(3)
200 V
discharge
(1)
Charged device model (CDM), per JEDEC specification 1000
JESD22-C101, all pins
(4)
(1) Human body model, 1.5 kΩ in series with 100 pF. Machine Model, 0 Ω in series with 200 pF.
(2) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.
(4) JEDEC document JEP157 states that 1000-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply Voltage (V
+
– V
−
) 2.7 12.8 V
Operating Temperature Range
(2)
−40 +85 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ R
θJA
. All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information
LMH6642 LMH6643 LMH6644
THERMAL METRIC
(1)
DBV05A D08A DGK08A D14A PW14A UNIT
5 PINS 8 PINS 8 PINS 14 PINS 14 PINS
R
θJA
Junction-to-ambient Thermal Resistance
(2)
265 190 235 145 155 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T
J(MAX)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ R
θJA
. All numbers apply for packages soldered directly onto a PC board.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
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