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OPA2320AIDRGT 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
WFDFN-8
描述:
精度， 20MHz的， 0.9pA ，低噪声， RRIO ， CMOS运算与关断放大器 Precision, 20MHz, 0.9pA, Low-Noise, RRIO, CMOS Operational Amplifier with Shutdown
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5Hot
典型应用电路图在P26P27
原理图在P1P16P26P30
封装尺寸在P32P34P35
标记信息在P32P33
封装信息在P31P32P33P34P35
技术参数、封装参数在P6P17P28
应用领域在P1
电气规格在P7P8P9
导航目录
OPA2320AIDRGT数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
2
OPA320
,
OPA2320
,
OPA320S
,
OPA2320S
SBOS513F –AUGUST 2010–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S
Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings...................................... 6
6.2 ESD Ratings.............................................................. 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information: OPA320 and OPA320S.......... 6
6.5 Thermal Information: OPA2320................................ 7
6.6 Thermal Information: OPA2320S.............................. 7
6.7 Electrical Characteristics........................................... 7
6.8 Typical Characteristics............................................ 10
7 Detailed Description............................................ 16
7.1 Overview................................................................. 16
7.2 Functional Block Diagram....................................... 16
7.3 Feature Description................................................. 16
7.4 Device Functional Modes........................................ 21
8 Application and Implementation ........................ 22
8.1 Application Information............................................ 22
8.2 Typical Application.................................................. 26
9 Power Supply Recommendations...................... 28
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Layout Example .................................................... 28
11 Device and Documentation Support................. 29
11.1 Device Support .................................................... 29
11.2 Documentation Support ........................................ 30
11.3 Related Links ........................................................ 30
11.4 Receiving Notification of Documentation Updates 30
11.5 Community Resource............................................ 30
11.6 Trademarks........................................................... 30
11.7 Electrostatic Discharge Caution............................ 30
11.8 Glossary................................................................ 31
12 Mechanical, Packaging, and Orderable
Information........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (June 2013) to Revision F Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed package families throughout data sheet: DFN to SON, MSOP to VSSOP, and SO to SOIC................................ 1
Changes from Revision D (November 2011) to Revision E Page
• Deleted Ordering Information table ........................................................................................................................................ 1
• Changed Shutdown, V
IH
and V
IL
parameters in Electrical Characteristics table.................................................................... 8
• Added Figure 29 and Figure 30............................................................................................................................................ 13
• Added Figure 31 and Figure 32............................................................................................................................................ 14
Changes from Revision C (August 2011) to Revision D Page
• Changed status of OPA2320 SO-8 (D) to production data from product preview. ................................................................ 1
Changes from Revision B (March 2010) to Revision C Page
• Deleted D (SO-8) package pinout drawing from Pin Configurations and Functions.............................................................. 4
• Changed names of pins 2 and 6 for DGS (MSOP-10) package ........................................................................................... 5
• Added values to Thermal Information tables, moved to new page, and updated format....................................................... 6
• Added SHDN value to Electrical Characteristics condition line.............................................................................................. 7
• Added new test condition row for Input Bias Current Over Temperature parameter............................................................. 7
• Changed test condition for Phase Margin parameter in Electrical Characteristics ................................................................ 8
• Added test condition to Short-Circuit Current parameter in Electrical Characteristics........................................................... 8
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