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6
OPA320
,
OPA2320
,
OPA320S
,
OPA2320S
SBOS513F AUGUST 2010REVISED DECEMBER 2016
www.ti.com
Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S
Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Voltage
Supply, V
S
= (V+) (V–) 6
V
Signal input pin
(2)
(V–) 0.5 (V+) + 0.5
Current
Signal input pin
(2)
–10 10
mA
Output short-circuit current
(3)
Continuous
Temperature
Operating range, T
A
–40 150
°CJunction, T
J
150
Storage, T
stg
–65 150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±4000
VCharged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
Machine model (MM) ±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
S
Specified voltage 1.8 5.5 V
T
A
Specified temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal
Metrics.
6.4 Thermal Information: OPA320 and OPA320S
THERMAL METRIC
OPA320 OPA320S
UNITDBV (SOT-23) DBV (SOT-23)
5 PINS 6 PINS
R
θJA
Junction-to-ambient thermal resistance
(1)
219.3 177.5 °C/W
R
θJC(top)
Junction-to-case(top) thermal resistance 107.5 108.9 °C/W
R
θJB
Junction-to-board thermal resistance 57.5 27.4 °C/W
ψ
JT
Junction-to-top characterization parameter 7.4 13.3 °C/W
ψ
JB
Junction-to-board characterization parameter 56.9 26.9 °C/W
R
θJC(bot)
Junction-to-case(bottom) thermal resistance ° C/W

OPA2320AIDRGT 数据手册

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