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LIS302DL 开发手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
加速度传感器
封装:
VFLGA-14
描述:
STMICROELECTRONICS LIS302DL 加速度计, MEMS, 3轴, 数字, X, Y, Z, ± 2g, ± 8g, 2.16 V, 3.6 V, LGA
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9Hot
原理图在P6P20P33
技术参数、封装参数在P8
应用领域在P40
导航目录
LIS302DL数据手册
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of 40 Go
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October 2006 Rev 2 1/40
AN2335
Application note
LIS302DL: 3-Axis - ±2g/±8g digital output
ultracompact linear accelerometer
Introduction
This document is intended to give application notes for the low-voltage 3-axis digital output
linear MEMS accelerometer provided in LGA package.
The LIS302DL is an ultra compact low-power three axes linear accelerometer that includes
a sensing element and an IC interface able to take the information from the sensing element
and to provide the measured acceleration to the external world through I
2
C/SPI serial
interface.
The sensing element, capable of detecting the acceleration, is manufactured using a
dedicated process developed by ST to produce inertial sensors and actuators in silicon.
The IC interface instead is manufactured using a CMOS process that allows high level of
integration to design a dedicated circuit which is factory trimmed to better match the sensing
element characteristics.
The LIS302DL has a user selectable full scale of ±2g, ±8g and it is capable of measuring
accelerations with an output data rate of 100Hz or 400Hz. A self-test capability allows the
user to check the correct operation of the system.
The device features two independent highly programmable interrupt sources that can be
configured either to generate an inertial wake-up interrupt signal when a programmable
acceleration threshold is exceeded along one of the three axes or to detect a free-fall event.
Two independent pins can be configured to provide interrupt signals to connected devices.
The LIS302DL is available in plastic SMD package and it is specified over a temperature
range extending from -40°C to +85°C.
The ultra small size and weight of this package make it an ideal choice for handheld portable
applications such as cell phones and PDAs or any other application where reduced package
size and weight are required.
www.st.com
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