Datasheet 搜索 > 微处理器 > NXP（恩智浦） > MCIMX6G2CVK05AA 数据手册 > MCIMX6G2CVK05AA 开发手册 1/137 页
器件3D模型￥ 77.577
MCIMX6G2CVK05AA 开发手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微处理器
封装:
BGA-272
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P10
封装尺寸在P17P29P106P107P108P109P110P111P112P113P114P115
型号编码规则在P3P4
技术参数、封装参数在P16P20P21P74P78P84
应用领域在P2P3P4P5P6P7P8P9P10P11P12P13
电气规格在P20P21P22P23P24P25P26P27P28P29P30P31
导航目录
MCIMX6G2CVK05AA数据手册
Page:
of 137 Go
若手册格式错乱，请下载阅览PDF原文件
Freescale Semiconductor, Inc
Data Sheet: Technical Data
Document Number: IMX6ULIEC
Rev. 1, 04/2016
MCIMX6GxCxxxxxA
Package Information
Plastic Package
BGA 14 x 14 mm, 0.8 mm pitch
BGA 9 x 9 mm, 0.5 mm pitch
Ordering Information
See Table 1 on page 3
© 2015-2016 Freescale Semiconductor, Inc. All rights reserved.
1 i.MX 6UltraLite Introduction
The i.MX 6UltraLite is a high performance, ultra
efficient processor family featuring Freescale’s
advanced implementation of the single ARM
Cortex
®
-A7 core, which operates at speeds up to 528
MHz. The i.MX 6UltraLite includes an integrated power
management module that reduces the complexity of the
external power supply and simplifies the power
sequencing. Each processor in this family provides
various memory interfaces, including LPDDR2, DDR3,
DDR3L, Raw and Managed NAND flash, NOR flash,
eMMC, Quad SPI, and a wide range of other interfaces
for connecting peripherals, such as WLAN, Bluetooth™,
GPS, displays, and camera sensors.
The i.MX 6UltraLite is specifically useful for
applications such as:
• Electronics Point-of-Sale device
• Telematics
i.MX 6UltraLite
Applications Processors
for Industrial Products
1. i.MX 6UltraLite Introduction . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
3.2. Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 20
4.2. Power Supplies Requirements and Restrictions . 28
4.3. Integrated LDO Voltage Regulator Parameters . . 29
4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . 31
4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 32
4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . 33
4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . 37
4.8. Output Buffer Impedance Parameters . . . . . . . . . 40
4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . 43
4.10. General-Purpose Media Interface (GPMI) Timing 58
4.11. External Peripheral Interface Parameters . . . . . . 66
4.12. A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 98
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . . 98
5.2. Boot Device Interface Allocation . . . . . . . . . . . . . 99
6. Package Information and Contact Assignments . . . . . 106
6.1. 14x14 mm Package Information . . . . . . . . . . . . 106
6.2. 9x9 mm Package Information . . . . . . . . . . . . . . 120
6.3. GPIO Reset Behaviors during Reset . . . . . . . . . 134
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
