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MURA140T3G 开发手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
TVS二极管
封装:
DO-214AC
描述:
ON SEMICONDUCTOR MURA140T3G 快速/超快二极管, 单, 400 V, 1 A, 1.1 V, 65 ns, 35 A
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MURA140T3G数据手册
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© Semiconductor Components Industries, LLC, 2012
May, 2017 − Rev. 5
1 Publication Order Number:
MURA230T3/D
MURA230T3G,
MURA240T3G,
SURA8240T3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.95 V Max @ 2.0 A, T
J
= 150°C)
• SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection:
♦ Human Body Model > 4000 V (Class 3)
♦ Machine Model > 400 V (Class C)
Device Package Shipping
†
ORDERING INFORMATION
ULTRAFAST RECTIFIERS
2 AMPERES, 300−400 VOLTS
SMA
CASE 403D
STYLE 1
PLASTIC
MARKING DIAGRAM
U5Fx = Device Code
x = F for MURA230T3
G for MURA240T3
A = Assembly Location**
Y = Year
WW = Work Week
G =Pb−Free Package
www.onsemi.com
SURA8240T3G* SMA
(Pb−Free)
5,000/Tape & Reel
MURA230T3G SMA
(Pb−Free)
5,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
U5x
AYWW G
MURA240T3G SMA
(Pb−Free)
5,000/Tape & Reel
** The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter pin)
,
the front side assembly code may be blank.
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