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NSI50350AST3G
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NSI50350AST3G数据手册
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AND9008/D
http://onsemi.com
3
Figure 2 shows power dissipation over changes in ambient temperature for the DPAK package on MCPCB material, Denka
K1. Table 2 shows maximum power dissipation for a given heat spreader area at 85°C. These tables and graphs illustrate the
effect of Cu area, thickness, clad material and ambient temperature (T
A
) over the range of 40°C to 125°C, which encompasses
an area of interest for general LED operation.
Figure 2. DPAK MCPCB PD vs. T
A
for T
J
= 1755C
Table 2.
PD max @ 855C DPAK
2500 mm
2
, Denka K1, 2 oz 6618 mW
1600 mm
2
, Denka K1, 2 oz 5202 mW
900 mm
2
, Denka K1, 2 oz 3830 mW
400 mm
2
, Denka K1, 2 oz 2486 mW
1000 mm
2
, FR4, 3 oz 2521 mW

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NSI50350AST3 数据手册

ON Semiconductor(安森美)
ON SEMICONDUCTOR  NSI50350AST3G  发光二极管驱动器, 1输出, 恒流, 50V输入, 350mA输出, DO-214AB-2
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