STTH1602CGY-TR 开发手册 - ST Microelectronics（意法半导体）

The behavior of a semiconductor device depends on the temperature of its silicon chip. This is the

reason why electrical parameters are given at a specified temperature. To sustain the performance of a

component and avoid failure, temperature must be limited by controlling the heat transfer between the

chip and the ambient atmosphere. The aim of this application note is to provide guidelines on package

mounting, handling and soldering, taking into account thermal requirements (heatsink for through-hole

packages, PCB design for surface mount packages components).