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TXS0108EPWRG4数据手册
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TXS0108E
SCES642C DECEMBER 2007REVISED DECEMBER 2014
www.ti.com
Pin Functions (continued)
PIN
TYPE DESCRIPTION
PW, RGY
NAME ZXY NO.
NO.
B7 13 C4 I/O Input/output 7. Referenced to V
CCB
B6 14 D4 I/O Input/output 6. Referenced to V
CCB
B5 15 C3 I/O Input/output 5. Referenced to V
CCB
B4 16 D3 I/O Input/output 4. Referenced to V
CCB
B3 17 C2 I/O Input/output 3. Referenced to V
CCB
B2 18 D2 I/O Input/output 2. Referenced to V
CCB
V
CCB
19 D1 S B-port supply voltage. 1.65 V V
CCB
5.5 V.
B1 20 C 1 I/O Input/output 1. Referenced to V
CCB
Thermal For the RGY package, the exposed center thermal pad must be connected to
Pad ground
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CCA
–0.5 4.6 V
Supply voltage
V
CCB
–0.5 5.5 V
A port –0.5 4.6
V
I
Input voltage
(2)
V
B port –0.5 6.5
A port –0.5 4.6
Voltage range applied to any output
V
O
V
in the high-impedance or power-off state
(2)
B port –0.5 6.5
A port –0.5 V
CCA
+ 0.5
V
O
Voltage range applied to any output in the high or low state
(2) (3)
V
B port –0.5 V
CCB
+ 0.5
I
IK
Input clamp current V
I
< 0 –50 mA
I
OK
Output clamp current V
O
< 0 –50 mA
I
O
Continuous output current –50 50 mA
Continuous current through V
CCA
, V
CCB
, or GND –100 100 mA
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of V
CCA
and V
CCB
are provided in the recommended operating conditions table.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
V
(ESD)
Electrostatic discharge V
C101
(2)
Machine model (MM) ±150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: TXS0108E

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