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1N34A 数据手册 - Microsemi(美高森美)
制造商:
Microsemi(美高森美)
分类:
功率二极管
封装:
DO-204AA
描述:
MICROSEMI 1N34A 二极管, 标准, 0.05A, 65V, DO-204AA-2, 整卷
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1N34A数据手册
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3
There are also many other considerations for a good quality
bond analysis when using cross sectioning for glass encapsu-
lated voidless construction such as those with Tungsten slugs
for Category I bonds. For example, scribe-and-break tech-
niques may not be practical for bond analysis since silicon
will often shatter with these voidless designs. During cross
sectioning, particular care must be taken to prevent inducing
voids from die to slug during initial grinding when micro frac-
turing of silicon silicides occur from variations in the type of
abrasive, grinding direction, pressure, etc. Also care must be
taken to prevent crack damage during cross sectioning. For
more details, refer to Microsemi MicroNOTE 035 entitled
“Metallographic Cross-Sectioning Techniques for the
Performance of DPA of Glass Encapsulated Voidless
Construction Diodes”.
Figure 6
Figure 7
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