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510ABA125M000AAGR 数据手册 - Skyworks Solutions
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510ABA125M000AAGR数据手册
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Si510/511
26 Rev. 1.4
15. PCB Land Pattern: 2.5 x 3.2 mm, 4-pin
Figure illustrates the 2.5 x 3.2 mm PCB land pattern for the Si510/511. Table 23 lists the values for the dimensions
shown in the illustration.
Figure 13. Si510/511 Recommended PCB Land Pattern
Table 23. PCB Land Pattern Dimensions (mm)
Dimension (mm)
C1 2.0
E2.10
X1 0.95
Y1 1.15
Notes:
General
1. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
Card Assembly
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
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