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ADS7953EVM-PDK 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
开发套件
描述:
开发套件, ADS7953 12位多通道模数转换器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P6P7Hot
典型应用电路图在P42P43P44P45P46P47
原理图在P1P27
封装尺寸在P51P52P53P54P55P57P58P59P60
标记信息在P51P52P53P54P55P56
封装信息在P50P51P52P53P54P55P56P57P58P59P60
技术参数、封装参数在P8
应用领域在P1P44P45P46P47P70
电气规格在P10P11P12P13P14P15
型号编号列表在P1
导航目录
ADS7953EVM-PDK数据手册
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若手册格式错乱，请下载阅览PDF原文件
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jul-2015
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ADS7960SDBT ACTIVE TSSOP DBT 38 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7960
ADS7960SDBTG4 ACTIVE TSSOP DBT 38 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7960
ADS7960SDBTR ACTIVE TSSOP DBT 38 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7960
ADS7960SRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 125 ADS
7960
ADS7960SRHBT ACTIVE VQFN RHB 32 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 125 ADS
7960
ADS7961SDBT ACTIVE TSSOP DBT 38 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7961
ADS7961SDBTG4 ACTIVE TSSOP DBT 38 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7961
ADS7961SDBTR ACTIVE TSSOP DBT 38 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7961
ADS7961SDBTRG4 ACTIVE TSSOP DBT 38 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS7961
ADS7961SRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 125 ADS
7961
ADS7961SRHBT ACTIVE VQFN RHB 32 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 125 ADS
7961
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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