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器件3D模型￥ 19.336
AT45DB161E-SHF-T 数据手册 - Adesto Technologies
制造商:
Adesto Technologies
分类:
Flash芯片
封装:
SOIC-8
描述:
AT45DB161 系列 16 Mb 数据闪存 2.3 - 3.6 V 85 MHz - SOIC-8 (200 mil)
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P2P3P71Hot
原理图在P4P54P55
封装尺寸在P67P68P69P70P71
型号编码规则在P34P63P64P65P66
封装信息在P63P67
技术参数、封装参数在P46
应用领域在P26
电气规格在P46
型号编号列表在P63
导航目录
AT45DB161E-SHF-T数据手册
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8782I–DFLASH–3/2016
Features
Single 2.3V - 3.6V or 2.5V - 3.6V supply
Serial Peripheral Interface (SPI) compatible
Supports SPI modes 0 and 3
Supports RapidS
™
operation
Continuous read capability through entire array
Up to 85MHz
Low-power read option up to 15MHz
Clock-to-output time (t
V
) of 6ns maximum
User configurable page size
512 bytes per page
528 bytes per page (default)
Page size can be factory pre-configured for 512 bytes
Two fully independent SRAM data buffers (512/528 bytes)
Allows receiving data while reprogramming the main memory array
Flexible programming options
Byte/Page Program (1 to 512/528 bytes) directly into main memory
Buffer Write
Buffer to Main Memory Page Program
Flexible erase options
Page Erase (512/528 bytes)
Block Erase (4KB)
Sector Erase (128KB)
Chip Erase (16-Mbits)
Program and Erase Suspend/Resume
Advanced hardware and software data protection features
Individual sector protection
Individual sector lockdown to make any sector permanently read-only
128-byte, One-Time Programmable (OTP) Security Register
64 bytes factory programmed with a unique identifier
64 bytes user programmable
Hardware and software controlled reset options
JEDEC Standard Manufacturer and Device ID Read
Low-power dissipation
400nA Ultra-Deep Power-Down current (typical)
3µA Deep Power-Down current (typical)
25µA Standby current (typical at 20MHz)
11mA Active Read current (typical)
Endurance: 100,000 program/erase cycles per page minimum
Data retention: 20 years
Complies with full industrial temperature range
Green (Pb/Halide-free/RoHS compliant) packaging options
8-lead SOIC (0.150" wide and 0.208" wide)
8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
9-ball Ultra-thin UBGA (6 x 6 x 0.6mm)
11-ball Wafer Level Chip Scale Package
Die in Wafer Form
AT45DB161E
16-Mbit DataFlash (with Extra 512-Kbits), 2.3V or 2.5V Minimum
SPI Serial Flash Memory
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