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B45196H2106K109
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B45196H2106K109数据手册
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Dimensional drawing
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100 or gold-plated
Reduced slot length for case size A
Dimensions
Case size Dimensions in mm (inches)
KEMET EIA/IECQ L W H
L
2
typ. W
2
±0.1 H
2
typ. P ±0.3
±(.004) ±(.012)
A 3216-18 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2 3.2 1.2 1.3 0.8
(.126
±0.008)
(.063
±0.008)
(.063
±0.008)
(.126) (.047) (.051) (.031)
B 3528-21 3.5 ±0.2 2.8 ±0.2 1.9 ±0.2 3.5 2.2 1.4 0.7
(.138
±0.008)
(.110
±0.008)
(.075
±0.008)
(.138) (.087) (.055) (.027)
C 6032-28 6.0 ±0.3 3.2 ±0.3 2.5 ±0.3 6.1 2.2 1.8 1.3
(.236
±0.012)
(.126
±0.012)
(.098
±0.012)
(.240) (.087) (.071) (.051)
D 7343-31 7.3 ±0.3 4.3 ±0.3 2.8 ±0.3 7.3 2.4 1.8 1.3
(.287
±0.012)
(.169
±0.012)
(.110
±0.012)
(.287) (.094) (.071) (.051)
E 7343-44 7.3 ±0.3 4.3 ±0.3 4.1 ±0.3 7.3 2.4 1.8 1.3
(.287
±0.012)
(.169
±0.012)
(.161
±0.012)
(.287) (.094) (.071) (.051)
Tantalum chip capacitors B45196E, B45198E, B45196H, B45198H
Standard / HighCap
Page 3 of 20Please read Important notes and
Cautions and warnings at the end of this document.

B45196H2106K109 数据手册

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B45196H2106 数据手册

KEMET Corporation(基美)
KEMET  B45196H2106K109  表面贴装钽电容, B45196系列, 10 µF, ± 10%, 10 V, 1206 [3216 公制], A
KEMET Corporation(基美)
KEMET Corporation(基美)
Epcos(爱普科斯)
KEMET Corporation(基美)
Epcos(爱普科斯)
KEMET Corporation(基美)
KEMET Corporation(基美)
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