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BUF634F/500 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
TO-263-6
描述:
BUF634F/500 编带
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P13P14
原理图在P10
封装尺寸在P20P22P23
标记信息在P20P21
封装信息在P19P20P21P22P23
技术参数、封装参数在P4
应用领域在P1P12P30
电气规格在P5P6P11
导航目录
BUF634F/500数据手册
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200Ω
I
1
(1)
V+
V
O
BW
V–
150Ω
4kΩ
Signal path indicated in bold.
Note: (1) Stage currents are set by I
1
.
Thermal
Shutdown
V
IN
BUF634
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
www.ti.com
7 Detailed Description
7.1 Overview
The BUF634 device is a high speed, unity-gain open-loop buffer recommended for a wide range of applications.
The BUF634 device can be used inside the feedback loop of op amps to increase output current, eliminate
thermal feedback, and improve capacitive load drive.
For low power applications, the BUF634 device operates on 1.5-mA quiescent current with 250-mA output, 2000-
V/µs slew rate, and 30-MHz bandwidth. Bandwidth can be adjusted from 30 MHz to 180 MHz by connecting a
resistor between V– and the BW Pin refer to Figure 9 and Figure 1. Output circuitry is fully protected by internal
current limit and thermal shut-down, making it rugged and easy to use.
See the Functional Block Diagram section for a simplified circuit diagram of the BUF634 showing its open-loop
complementary follower design.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Output Current
The BUF634 device can deliver up to ±250-mA continuous output current. Internal circuitry limits output current
to approximately ±350 mA; see Figure 10. For many applications, however, the continuous output current will be
limited by thermal effects.
The output voltage swing capability varies with junction temperature and output current (see Figure 14). Although
all four package types are tested for the same output performance using a high speed test, the higher junction
temperatures with the DIP and SO-8 package types often provide less output voltage swing. Junction
temperature is reduced in the DDPAK surface-mount power package because it is soldered directly to the circuit
board. The TO-220 package used with a good heat sink further reduces junction temperature, allowing maximum
possible output swing.
10 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: BUF634
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