Datasheet 搜索 > RF射频器件 > TI(德州仪器) > CC2511F32RSPR 数据手册 > CC2511F32RSPR 数据手册 30/245 页


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CC2511F32RSPR 数据手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
RF射频器件
封装:
QFN-36
描述:
低功耗的SoC (系统级芯片)与MCU,存储器, 2.4 GHz射频收发器和USB控制器 Low-Power SoC (System-on-Chip) with MCU, Memory, 2.4 GHz RF Transceiver, and USB Controller
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P38
原理图在P30P38P137P167P207
封装尺寸在P236P238P239
焊盘布局在P38
标记信息在P236P237
封装信息在P236P237P238P239
焊接温度在P8
功能描述在P1P6
技术参数、封装参数在P8P10
应用领域在P1P245
电气规格在P10
导航目录
CC2511F32RSPR数据手册
Page:
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若手册格式错乱,请下载阅览PDF原文件

CC2510Fx / CC2511Fx
SWRS055G Page 30 of 236
8 Circuit Description
Figure 9:
C C2510Fx/CC2511Fx
Block Diagram
A block diagram of
CC2510Fx/CC2511Fx
is shown
in Figure 9. The modules can be divided into
one out of three categories: CPU-related
modules, radio-related modules, and modules
related to power, test, and clock distribution. In
the following subsections, a short description
of each module that appears in Figure 9.
CC2511F8 - Not Recommended for New Designs
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