器件3D模型

￥ 0

CD4040BPWG4 数据手册 - TI（德州仪器）

制造商:

TI（德州仪器）

分类:

逻辑控制器

封装:

TSSOP-16

描述:

CMOS纹波进位二进制计数器/除法器 CMOS Ripple-Carry Binary Counter / Dividers

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

封装尺寸在P5P6P7P9P10

标记信息在P5P6P7

封装信息在P5P6P7P8P9P10

应用领域在P8P22

导航目录

封装尺寸在P5 P6 P7 P9 P10
标记信息在P5 P6 P7
封装信息在P5 P6 P7 P8 P9 P10
应用领域在P8 P22

CD4040BPWG4数据手册

Page:

of 22 Go

PDF下载

若手册格式错乱，请下载阅览PDF原文件

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CD4040BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM040B

JM38510/05653BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

05653BEA

JM38510/05655BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

05655BCA

M38510/05653BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

05653BEA

M38510/05655BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

05655BCA

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.