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CD4067BE 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
DIP-24
描述:
TEXAS INSTRUMENTS CD4067BE 芯片, 模拟多路复用器/信号分离器
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CD4067BE数据手册
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MC14067B
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC−24 WB
CASE 751E−04
ISSUE F
b
M
0.25 C
SEATING
PLANE
A1
M
L
DETAIL A
END VIEW
h
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
TION OF THE LEAD AND ARE MEASURED
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
NOTE 3
PIN 1
12
1
24 13
TOP VIEW
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
b 0.35 0.49
e 1.27 BSC
h 0.25 0.75
c 0.23 0.32
A1 0.13 0.29
L 0.41 0.90
M 0 8
__
D
E1
SIDE VIEW
11.00
24X
0.52
24X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E 10.30 BSC
RECOMMENDED
INDICATOR
A B
0.25 C
24X
B
A
C
A
NOTE 5
x 45
c
NOTE 3
DETAIL A
C
H
D 15.25 15.54
E1 7.40 7.60
E
S S
e
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MC14067B/D
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