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器件3D模型￥ 2.034
CD4073BMT 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑芯片
封装:
SOIC-14
描述:
CMOS和盖茨 CMOS AND GATES
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P5P6P7P9P10P16P17P18P20P21
标记信息在P16P17P18P19
封装信息在P5P6P7P8P9P10P16P17P18P19P20P21
应用领域在P19P29
导航目录
CD4073BMT数据手册
Page:
of 29 Go
若手册格式错乱，请下载阅览PDF原文件
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
CD4082BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BME4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BMT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BNSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4082BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
JM38510/17001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/17002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/17003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 3
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