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器件3D模型￥ 120.29
CD4075BF 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑芯片
封装:
CDIP
描述:
CMOS或门 CMOS OR GATES
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P5P6P7P9P10P16P17P18P20P21
标记信息在P16P17P18P19
封装信息在P5P6P7P8P9P10P16P17P18P19P20P21
应用领域在P19P29
导航目录
CD4075BF数据手册
Page:
of 29 Go
若手册格式错乱，请下载阅览PDF原文件
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
CD4075BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BNSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4075BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
JM38510/17101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/17103BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 3
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