Datasheet 搜索 > 逻辑芯片 > TI（德州仪器） > CD4081BMG4 数据手册 > CD4081BMG4 数据手册 24/31 页
器件3D模型￥ 1.424
CD4081BMG4 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑芯片
封装:
SOIC-14
描述:
CMOS和盖茨 CMOS AND Gates
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P5P6P7P9P10P16P17P18P20P21P24
焊盘布局在P25
标记信息在P16P17P18P19
封装信息在P5P6P7P8P9P10P16P17P18P19P20P21
应用领域在P19
导航目录
CD4081BMG4数据手册
Page:
of 31 Go
若手册格式错乱，请下载阅览PDF原文件
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308
-7.977.83[ ]
14X -.026.014
-0.660.36[ ]
14X -.065.045
-1.651.15[ ]
.2 MAX TYP
[5.08]
.13 MIN TYP
[3.3]
TYP-.060.015
-1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754
-19.9419.15[ ]
B -.283.245
-7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
7
8
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
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