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DAC088S085
SNAS424D AUGUST 2007REVISED APRIL 2016
www.ti.com
Product Folder Links: DAC088S085
Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated
(1) WQFN only
Pin Functions
PIN
TYPE DESCRIPTION
NAME
NO.
WQFN TSSOP
D
IN
15 1 Digital Input
Serial Data Input. Data is clocked into the 16-bit shift register on the falling edges of
SCLK after the fall of SYNC.
D
OUT
16 2 Digital Output
Serial Data Output. D
OUT
is used in daisy chain operation and is connected directly to a
D
IN
pin on another DAC088S085. Data is not available at D
OUT
unless SYNC remains
low for more than 16 SCLK cycles.
GND 8 10 Ground Ground reference for all on-chip circuitry.
SCLK 14 16 Digital Input
Serial Clock Input. Data is clocked into the input shift register on the falling edges of
this pin.
SYNC 13 15 Digital Input
Frame Synchronization Input. When this pin goes low, data is written into the DAC's
input shift register on the falling edges of SCLK. After the 16th falling edge of SCLK, a
rising edge of SYNC causes the DAC to be updated. If SYNC is brought high before
the 15th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the
write sequence is ignored by the DAC.
V
A
5 7 Supply Power supply input. Must be decoupled to GND.
V
OUTA
1 3 Analog Output Channel A Analog Output Voltage.
V
OUTB
2 4 Analog Output Channel B Analog Output Voltage.
V
OUTC
3 5 Analog Output Channel C Analog Output Voltage.
V
OUTD
4 6 Analog Output Channel D Analog Output Voltage.
V
OUTE
12 14 Analog Output Channel E Analog Output Voltage.
V
OUTF
11 13 Analog Output Channel F Analog Output Voltage.
V
OUTG
10 12 Analog Output Channel G Analog Output Voltage.
V
OUTH
9 11 Analog Output Channel H Analog Output Voltage.
V
REF1
6 8 Analog Input
Unbuffered reference voltage shared by Channels A, B, C, and D. Must be decoupled
to GND.
V
REF2
7 9 Analog Input
Unbuffered reference voltage shared by Channels E, F, G, and H. Must be decoupled
to GND.
PAD
(1)
Ground
Exposed die attach pad can be connected to ground or left floating. Soldering the pad
to the PCB offers optimal thermal performance and enhances package self-alignment
during reflow.

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