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器件3D模型￥ 0.254
ERT-J0EG103HA 数据手册 - Panasonic（松下）
制造商:
Panasonic（松下）
分类:
热敏电阻
封装:
0402
描述:
NTC热敏电阻 Multilayer Chip NTC Thermister
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ERT-J0EG103HA数据手册
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Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
– 366 –
1.0
Test Sample
0.5R
0.3/Size:0201
0.5/Size:0402
Board
1.0
Test
Sample
Unit : mm
20
45±245±2
Bending
distance
Unit : mm
R340
■ Specifi cation and Test Method
Item
Specifi cation Test Method
Rated Zero-power
Resistance (R
25
)
Within the specifi ed tolerance. The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
B Value Within the specifi ed tolerance.
✽
Individual Specifi cation shall specify B
25/50
or
B
25/85
.
The Zero-power resistances; R
1
and R
2
, shall be
measured respectively at T
1
(°C) and T
2
(°C).
The B value is calculated by the following equation.
B
T
1
/T
2
=
k
n (R
1
)–
k
n (R
2
)
1/(T
1
+273.15)–1/(T
2
+273.15)
T
1
T
2
B
25/50
25.0 ±0.1 °C 50.0 ±0.1 °C
B
25/85
25.0 ±0.1 °C 85.0 ±0.1 °C
Adhesion The terminal electrode shall be free from peeling
or signs of peeling.
Applied force :
Size 0201 : 2 N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
Size : 0603
Bending Strength There shall be no cracks and other mechanical
damage.
R
25
change : within ±5 %
Bending distance : 1 mm
Bending speed : 1 mm/s
Resistance to
Soldering Heat
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
R
25
change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period : 3.0 ±0.5 s
Preheat condition :
Step Temp (°C) Period (s)
180 to 100120 to 180
2150 to 200120 to 180
Solderability More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
Sep. 201000
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