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器件3D模型￥ 26.671
FDC1004QDGSRQ1 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
VSSOP-10
描述:
电容触摸传感器 Automotive, 4-Channel Capacitance-to-Digital Converter for Capacitive Sensing (Cap Sensing) 10-VSSOP -40 to 125
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P1P20P21
原理图在P9
封装尺寸在P24P26P27
标记信息在P24
封装信息在P23P24P25P26P27
技术参数、封装参数在P4P5
应用领域在P1P9P19P23P29
电气规格在P5
导航目录
FDC1004QDGSRQ1数据手册
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FDC1004Q
SNOSCZ4 –APRIL 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
MIN MAX UNIT
Input voltage VDD –0.3 6 V
SCL, SDA –0.3 6 V
at any other pin –0.3 VDD+0.3 V
Input current at any pin 3 mA
Junction temperature
(2)
150 °C
Storage Temperature T
STG
-65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of T
J(MAX)
, R
θJA
, and the ambient temperature, T
A
. The maximum allowable power
dissipation at any ambient temperature is P
DMAX
= (T
J(MAX)
- T
A
)/ R
θJA
. All numbers apply for packages soldered directly onto a PC
board.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per AEC Q100-002
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per AEC Q100-011 ±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
Over operating temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage (VDD-GND) 3 3.3 3.6 V
Temperature –40 125 °C
7.4 Thermal Information
FDC1004Q
THERMAL METRIC
(1)
VSSOP (DGS) UNIT
10 PINS
R
θJA
Junction-to-ambient thermal resistance 46.8 °C/W
R
θJC
Junction-to-case(top) thermal resistance 48.7 °C/W
R
θJB
Junction-to-board thermal resistance 70.6 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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