Datasheet 搜索 > IGBT晶体管 > Infineon(英飞凌) > FP15R12W1T4B11BOMA1 数据手册 > FP15R12W1T4B11BOMA1 数据手册 1/1 页

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FP15R12W1T4B11BOMA1 数据手册 - Infineon(英飞凌)
制造商:
Infineon(英飞凌)
分类:
IGBT晶体管
封装:
AG-EASY1B-2
描述:
晶体管, IGBT阵列&模块, N沟道, 28 A, 1.85 V, 130 W, 1.2 kV, Module
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
FP15R12W1T4B11BOMA1数据手册
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Material group Materials
CAS-Nr.
if applicable
Average
mass
[%]*
Sum
[%]
Traces Comment
inorganic material silicon 7440-21-3 1 1
non noble metal copper 7440-50-8 22
inorganic material aluminium oxid 1344-28-1 9
non noble metal tin 7440-31-5 1
noble metal silver 7440-22-4 1
non noble metal magnesium 7439-95-4 X
non noble metal cobalt 7440-48-4 X
non noble metal aluminium 7429-90-5 X
polymers silicone gel 16 16
polymers PBT 22,9
inorganic material antimonytrioxide 1309-64-4 2,4
plastics brominated resin 1,6
plastics chlorinated resin 1,1
inorganic material silicondioxide / glasfiber 12
ferrous metal X12CrNi17-7(1.4310) 5
non noble metal tin 7440-31-5 X
non noble metal copper 7440-50-8 5
non noble metal zinc 7440-66-6 X
non noble metal nickel 7440-02-0 X
inorganic material lead oxide 1317-36-8 0,2 RoHS compliant
non noble metal copper 7440-50-8 X
non noble metal tin 7440-31-5 X
noble metal silver 7440-22-4 X
<25% 100
22,0 g
<25%
Company
Address
Internet
Easy1 B-Series
2011-11-29
3.0
RoHS compliant
Yes
Construction element
chip
Material Content Data Sheet
Sum in total
substrate including
metallisation
81726 München
www.infineon.com
1) This document provides full declaration of all materials present in Infineon products above a threshold
of 0,1 % b.w. (1000 ppm).
2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they
represent substances-of-concern.
A list of substances-of-concern can be found at http://www.infineon.com/soc.
3) All statements are based on our present knowledge and are subject to change at any time due to
technical requirements and development.
Important Remarks:
wire
encapsulation
housing
Umbrella Spec
Date
Revision
clamp
Weight range of product family
Fluctuation margin
*) related to component weight
**) Weight of particular product, see technical product information
Infineon Technologies
AG
lead, finish and plating
SMD (including thermistors,
resistors and shunts)
deviation
33
40
10
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