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ISD4002-240P 数据手册 - Nuvoton Technology（新唐）
制造商:
Nuvoton Technology（新唐）
封装:
DIP-28
Pictures:
3D模型
符号图
焊盘图
引脚图
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页面导航:
引脚图在P6P7P24Hot
典型应用电路图在P27P37
原理图在P4P15
型号编码规则在P35
封装信息在P30
功能描述在P2P12
技术参数、封装参数在P20
电气规格在P22
型号编号列表在P20P35
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ISD4002-240P数据手册
Page:
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ISD4002 SERIES
Publication Release Date: September 2003
- 37 - Revision 1
Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.
No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,
Science-Based Industrial Park, CA 95134, U.S.A. 200336 China
Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999
TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998
FAX: 886-3-5665577 http://www.winbond-usa.com/
http://www.winbond.com.tw/
Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.
9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,
Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,
Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong
TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100
FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond
makes no representation or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to discontinue or make changes to specifications and product descriptions at
any time without notice. No license, whether express or implied, to any intellectual property or other right o
f
Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and
Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty o
f
merchantability, fitness for a particular purpose or infringement of any Intellectual property.
Winbond products are not designed, intended, authorized or warranted for use as components in systems o
r
equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for othe
r
applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications
wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe
property or environmental injury could occur.
A
pplication examples and alternative uses of any integrated circuit contained in this publication are for illustration
only and Winbond makes no representation or warranty that such applications shall be suitable for the use
specified.
ISD
®
and ChipCorder
®
are trademarks of Winbond Electronics Corporation.
The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published
in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product
incorporates SuperFlash
®
technology licensed from SST.
Information contained in this ISD
®
ChipCorder
®
data sheet supersedes all data for the ISD ChipCorder products
published by ISD
®
prior to August, 1998.
This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD
®
ChipCorder
®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information
in this, the information contained herein supersedes and governs such other information in its entirety.
Copyright
©
2003, Winbond Electronics Corporation. All rights reserved. ChipCorder
®
ISD
®
are registered
trademark of Winbond. All other trademarks are properties of their respective owners.
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