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器件3D模型￥ 10.91
ISO7140CCDBQR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口隔离器
封装:
SSOP-16
描述:
4242 - VPK小尺寸和低功耗三核和四通道数字隔离器 4242-VPK Small-Footprint and Low-Power Triple and Quad Channels Digital Isolators
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4Hot
典型应用电路图在P21P22P23P24
原理图在P1P16P20
封装尺寸在P27P29P30
标记信息在P27P28
封装信息在P26P27P28P29P30
技术参数、封装参数在P5P17P18
应用领域在P1P21P22P23P24P32
电气规格在P6P7
型号编号列表在P18
导航目录
ISO7140CCDBQR数据手册
Page:
of 32 Go
若手册格式错乱，请下载阅览PDF原文件
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ISO7131CCDBQ ACTIVE SSOP DBQ 16 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7131CC
ISO7131CCDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7131CC
ISO7140CCDBQ ACTIVE SSOP DBQ 16 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7140CC
ISO7140CCDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7140CC
ISO7140FCCDBQ ACTIVE SSOP DBQ 16 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7140FC
ISO7140FCCDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7140FC
ISO7141CCDBQ ACTIVE SSOP DBQ 16 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7141CC
ISO7141CCDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7141CC
ISO7141FCCDBQ ACTIVE SSOP DBQ 16 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7141FC
ISO7141FCCDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 7141FC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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