Datasheet 搜索 > 双极性晶体管 > Fairchild（飞兆/仙童） > KSA1298YMTF 数据手册 > KSA1298YMTF 数据手册 1/21 页
￥ 0.146
KSA1298YMTF 数据手册 - Fairchild（飞兆/仙童）
制造商:
Fairchild（飞兆/仙童）
分类:
双极性晶体管
封装:
SOT-23-3
描述:
PNP 晶体管，高达 30V，Fairchild Semiconductor### 双极晶体管，Fairchild Semiconductor双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。 创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
导航目录
KSA1298YMTF数据手册
Page:
of 21 Go
若手册格式错乱，请下载阅览PDF原文件
Date Created : 2007/11/30
Date Issued On : 2007/12/12
PCN# : Q4074815
FORECAST CHANGE NOTIFICATION
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
Technical Contact:
Name: Yeoh, LiangChoon
E-mail: Liang.Yeoh@fairchildsemi.com
Phone:
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/03/30
Earliest Year/Work Week of Changed Product: 0814
Change Type Description: Mold Compound
Description of Change (From): SOT23 and SC70 package assembly at all FSC approved
manufacturing locations (FSCP, CARSEM, HANA, UTL, AUK in Dalian, China, JCET,
FSPM) using non Green mold compound as shown in table 1:
Description of Change (To): SOT23 and SC70 package assembly at all FSC approved
manufacturing locations (FSCP, CARSEM, HANA, UTL, AUK in Dalian, China, JCET,
FSPM) using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070464
Qualification :
Qualification of Green Mold compound for SOT23 and SC70 packages.
Pg. 1
Downloaded from Elcodis.com electronic components distributor
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
