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LM27761DSGR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
WSON-8
描述:
LM27761DSGR 编带
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LM27761DSGR数据手册
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4
LM27761
SNVSA85C –OCTOBER 2015–REVISED JANUARY 2017
www.ti.com
Product Folder Links: LM27761
Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(3) The maximum power dissipation must be de-rated at elevated temperatures and is limited by T
JMAX
(maximum junction temperature), T
A
(ambient temperature) and R
θJA
(junction-to-ambient thermal resistance). The maximum power dissipation at any temperature is:
P
DissMAX
= (T
JMAX
– T
A
)/R
θJA
up to the value listed in the Absolute Maximum Ratings.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
Ground voltage, VIN to GND or GND to VOUT 5.8 V
EN (GND − 0.3 V) (V
IN
+ 0.3 V)
Continuous output current, CPOUT and VOUT 300 mA
T
JMAX
(3)
150 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating ambient temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
Operating input voltage, V
IN
2.7 5.5 V
Operating output current, I
OUT
0 250 mA
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.4 Thermal Information
THERMAL METRIC
(1)
LM27761
UNITWSON (DSG)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 67.7 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 89.9 °C/W
R
θJB
Junction-to-board thermal resistance 37.6 °C/W
ψ
JT
Junction-to-top characterization parameter 2.4 °C/W
ψ
JB
Junction-to-board characterization parameter 38 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 9.4 °C/W
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