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LM2937IMPX-12/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
SOT-223-4
描述:
LM2937 500毫安低压差稳压器 LM2937 500 mA Low Dropout Regulator
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P13
原理图在P1P11
封装尺寸在P20P21P23P24P25
标记信息在P20P21P22
封装信息在P19P20P21P22P23P24P25
技术参数、封装参数在P4P14
应用领域在P1P30
电气规格在P5P6P7P13
导航目录
LM2937IMPX-12/NOPB数据手册
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LM2937
SNVS100F –MARCH 2000–REVISED JULY 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Continuous 26
Input voltage (V
IN
) V
Transient (t ≤ 100 ms) 60
Internal power dissipation
(3)
Internally limited
Maximum junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125°C − T
A
)/R
θJA
, where 125 is the maximum junction
temperature for operation, T
A
is the ambient temperature, and R
θJA
is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown.
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range −65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000
V
(ESD)
Electrostatic discharge V
pins
(1)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
(1)
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
LM2937ET (NDE), LM2937ES (KTT) −40 125
Junction temperature (T
J
)
(2)
°C
LM2937IMP (DCY) −40 85
Input voltage (V
IN
) V
OUT
+ 1V 26 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125°C − T
A
)/R
θJA
, where 125°C is the maximum
junction temperature for operation, T
A
is the ambient temperature, and R
θJA
is the junction-to-ambient thermal resistance. If this
dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature
rises above 150°C, the LM2937 will go into thermal shutdown.
6.4 Thermal Information
LM2937
THERMAL METRIC
(1)
NDE
(2)
KTT DCY UNIT
3 PINS 3 PINS 4 PINS
R
θJA
Junction-to-ambient thermal resistance 77.9 41.8 58.3
R
θJC(top)
Junction-to-case (top) thermal resistance 35.5 43.5 39.2
R
θJB
Junction-to-board thermal resistance 70.6 0.8 N/A
°C/W
ψ
JT
Junction-to-top characterization parameter 13 23.5 7
ψ
JB
Junction-to-board characterization parameter 70.6 10.3 1.6
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 1 22.5 22.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Thermal information for the TO-220 package is for a free-standing package vertically mounted in the middle of a PCB which is compliant
to the JEDEC HIGH-K 2s2p (JESD51-7) specifications. No additional heat sink is attached. See Heatsinking TO-220 Package Parts
section for more information.
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