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LM2941
,
LM2941C
www.ti.com
SNVS770I JUNE 1999REVISED JANUARY 2015
6.4 Thermal Information
LM2941LD LM2941S, LM2941T
WSON TO-263 TO-220
THERMAL METRIC
(1)(2)
UNIT
(NGN) (KTT) (KC)
8 PINS 5 PINS 5 PINS
R
θJA
Junction-to-ambient thermal resistance 40.5 41 32.1
R
θJC(top)
Junction-to-case (top) thermal resistance 26.2 43.2 25.6
R
θJB
Junction-to-board thermal resistance 17 22.9 18.3
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2 11.4 8.5
ψ
JB
Junction-to-board characterization parameter 17.2 21.9 17.7
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 3.2 0.9 0.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T
J
(max), R
θJA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J
(max) T
A
)/R
θJA
. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will
go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper
area thermally connected to the package. The value R
θJA
for the WSON package is specifically dependent on PCB trace area, trace
material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,
refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal
performance.
6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD
5 V V
OUT
20 V, V
IN
= V
OUT
+ 5 V, C
OUT
= 22 μF, unless otherwise specified. MIN (minimum) and MAX (maximum)
specifications in apply over the full Operating Temperature Range (unless otherwise specified) and typical values apply at T
J
= 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
5 mA I
OUT
1 A
(1)
1.211 1.275 1.339
Reference voltage V
5 mA I
OUT
1 A
(1)
, T
J
= 25°C 1.237 1.275 1.313
Line regulation V
OUT
+ 2 V V
IN
26 V, I
OUT
= 5 mA 4 10 mV/V
Load regulation 50 mA I
OUT
1 A 7 10 mV/V
Output impedance 100 mADC and 20 mArms, ƒ
OUT
= 120 Hz 7 mΩ/V
V
OUT
+ 2 V V
IN
< 26 V, I
OUT
= 5 mA 10 20
mA
V
OUT
+ 2 V V
IN
< 26 V, I
OUT
= 5 mA, T
J
=
10 15
25°C
Quiescent current
V
IN
= V
OUT
+ 5 V, I
OUT
= 1 A 30 60
mA
V
IN
= V
OUT
+ 5 V, I
OUT
= 1 A, T
J
= 25°C 30 45
RMS output noise, % of V
OUT
10 Hz to 100 kHz, I
OUT
= 5 mA 0.003%
ƒ
OUT
= 120 Hz, 1 Vrms, I
L
= 100 mA 0.005 0.04
Ripple rejection %/V
ƒ
OUT
= 120 Hz, 1 Vrms, I
L
= 100 mA, T
J
= 25°C 0.005 0.02
Long-term stability 0.4 %/1000 Hr
I
OUT
= 1 A 0.5 1
V
Dropout voltage I
OUT
= 1 A, T
J
= 25°C 0.5 0.8
I
OUT
= 100 mA 110 200 mV
Short-circuit current V
IN
max = 26 V
(2)
1.6 1.9 A
V
OUT
max 1 V above nominal V
OUT
75
Maximum line transient 60 V
R
OUT
= 100 Ω, t 100 ms
Maximum operational input
26 31 V
DC
voltage
Reverse polarity
R
OUT
= 100 Ω, V
OUT
0.6 V 15 30
DC input voltage
V
Reverse polarity
t 100 ms, R
OUT
= 100 Ω 50 75
transient input voltage
(1) The output voltage range is 5 V to 20 V and is determined by the two external resistors, R1 and R2. See Figure 18.
(2) Output current capability will decrease with increasing temperature, but will not go below 1 A at the maximum specified temperatures.
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
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