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LM317MDCYRG3 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-261-4
描述:
TEXAS INSTRUMENTS LM317MDCYRG3 芯片, 可调线性稳压器 1.25V 至 37V SOT-223-4, 整卷
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LM317MDCYRG3数据手册
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LM317M
SLVS297P –APRIL 2000–REVISED MARCH 2014
www.ti.com
Table of Contents
7.3 Feature Description................................................... 7
1 Features.................................................................. 1
7.4 Device Functional Modes.......................................... 8
2 Applications ........................................................... 1
8 Applications and Implementation ........................ 9
3 Description............................................................. 1
8.1 Application Information.............................................. 9
4 Revision History..................................................... 2
8.2 Typical Application.................................................... 9
5 Terminal Configuration and Functions................ 3
9 Power Supply Recommendations...................... 11
6 Specifications......................................................... 3
10 Layout................................................................... 11
6.1 Absolute Maximum Ratings ..................................... 3
10.1 Layout Guidelines ................................................. 11
6.2 Handling Ratings....................................................... 3
10.2 Layout Example .................................................... 11
6.3 Recommended Operating Conditions....................... 3
11 Device and Documentation Support................. 12
6.4 Thermal Information.................................................. 4
11.1 Trademarks........................................................... 12
6.5 Electrical Characteristics........................................... 4
11.2 Electrostatic Discharge Caution............................ 12
6.6 Typical Characteristics.............................................. 5
11.3 Glossary................................................................ 12
7 Detailed Description.............................................. 7
12 Mechanical, Packaging, and Orderable
7.1 Overview................................................................... 7
Information........................................................... 12
7.2 Functional Block Diagram......................................... 7
4 Revision History
Changes from Revision O (July 2006) to Revision P Page
• Removed Ordering Information Table ................................................................................................................................... 1
• Clarified T
J
package field ....................................................................................................................................................... 3
2 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated
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