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LM3551/2
V
IN
V
C
GND
SW
FB
FET-T
FET-F
-+
C
IN
C
OUT
R
T
R
F
D1
R
C
C
C
V
BAT
SS
OVP
C
FTO
FTO
C
SS
SD/EN
T/F
Sharp
GM5BW05340A
Flash LED
4.7 PF
16V
10 PF
10V
4.7 PH
R
C
= 27 k:
C
C
= 10 nF
LM3551/2
SD/
EN
T/F
V
IN
V
C
GND
SW
FB
FET-T
FET-F
C
IN
C
OUT
R
T
R
F
D1
R
C
C
C
V
BAT
SS
OVP
C
FTO
FTO
LUMILED
LXCL-PWF1
Flash LED
10 Fµ
16V
10 Fµ
10V
C
SS
4.7 µH
R
C
= 10 kΩ
C
C
= 4.7 nF
+
LM3551, LM3552
www.ti.com
SNVS371D AUGUST 2005REVISED MAY 2013
THERMAL PROTECTION
Internal thermal protection circuitry disables the LM3551/2 when the junction temperature exceeds +140°C (typ.).
This feature protects the device from being damaged by high die temperatures that might otherwise result from
excessive power dissipation. The device will recover and operate normally when the junction temperature falls
below +120°C (typ.). It is important that the board layout provide good thermal conduction to keep the junction
temperature within the specified operating ratings.
PCB LAYOUT CONSIDERATIONS
The WSON is a leadframe based Chip Scale Package (CSP) with very good thermal properties. This package
has an exposed DAP (die attach pad) at the center of the package measuring 2.6mm x 3.0mm. The main
advantage of this exposed DAP is to offer lower thermal resistance when it is soldered to the thermal land pad
on the PCB. For PCB layout, Texas Instruments highly recommends a 1:1 ratio between the package and the
PCB thermal land. To further enhance thermal conductivity, the PCB thermal land may include vias to a ground
plane. For more detailed instructions on mounting WSON packages, please refer to Application Note AN-1187
(SNOA401)
Application Examples
TYPICAL CONFIGURATIONS
Figure 16. LUMILED LXCL-PWF1
R
T
= 5.6, R
F
= 2.2
I
TORCH
= 200mA, I
FLASH
= 700mA
Figure 17. SHARP GM5BW05340A
R
T
= 17, R
F
= 6.5
I
TORCH
= 75mA, I
FLASH
= 250mA
Copyright © 2005–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
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LM3552SD/NOPB 数据手册

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