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LM46002
ZHCSCD8B APRIL 2014REVISED SEPTEMBER 2014
www.ti.com.cn
Copyright © 2014, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
Over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
Input Voltages
VIN to PGND -0.3 65
V
EN to PGND -0.3 VIN + 0.3
FB, RT, SS/TRK to AGND -0.3 3.6
PGOOD to AGND -0.3 15
SYNC to AGND -0.3 5.5
BIAS to AGND -0.3 30
AGND to PGND -0.3 0.3
Output Voltages
SW to PGND -0.3 VIN + 0.3
V
SW to PGND less than 10ns Transients -3.5 65
CBOOT to SW -0.3 5.5
VCC to AGND -0.3 3.6
(1) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by assembly line electrostatic discharges into
the device.
(2) ESD testing is performed according to the respective JESD22 JEDEC standard.
7.2 Handling Ratings
PARAMETER DEFINITION MIN MAX UNIT
T
stg
Storage temperature range -65 +150 °C
V
ESD
(1)(2)
HBM Human body model 2.0
kV
CDM Charge device model 0.5
(1) Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits.
For guaranteed specifications, see Electrical Characteristics.
7.3 Recommended Operating Conditions
(1)
Over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
Input Voltages
VIN to PGND 3.5 60
V
EN -0.3 VIN
FB -0.3 1.1
PGOOD -0.3 12
BIAS input not used -0.3 0.3
BIAS input used 3.3 28
AGND to PGND -0.1 0.1
Output Voltage V
OUT
1.0 28 V
Output Current I
OUT
0 2 A
Temperature Operating junction temperature range, T
J
-40 +125 °C

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