Datasheet 搜索 > 稳压芯片 > TI（德州仪器） > LM5117QPMHX/NOPB 数据手册 > LM5117QPMHX/NOPB 数据手册 6/43 页
器件3D模型￥ 24.795
LM5117QPMHX/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TSSOP-20
描述:
开关控制器 Wide Input Range Sync Buck Cntlr
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4P5Hot
典型应用电路图在P1P22
原理图在P11P12P22
封装尺寸在P37P39P40
焊盘布局在P35
标记信息在P37P38
封装信息在P36P37P38P39P40
技术参数、封装参数在P5
应用领域在P1P22P43
电气规格在P6P7P8
导航目录
LM5117QPMHX/NOPB数据手册
Page:
of 43 Go
若手册格式错乱，请下载阅览PDF原文件
LM5117
,
LM5117-Q1
SNVS698F –APRIL 2011–REVISED AUGUST 2015
www.ti.com
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
VIN
(2)
5.5 65 V
VCC 5.5 14 V
HB to SW 5.5 14 V
Junction temperature -40 125 °C
(1) Recommended Operating Conditions are conditions under which operation of the device is intended to be functional, but does not
ensure specific performance limits. For specifications and test conditions see Electrical Characteristics.
(2) Minimum VIN operating voltage is defined with VCC supplied by the internal HV startup regulator and no external load on VCC. When
VCC is supplied by an external source, minimum VIN operating voltage is 4.5 V.
6.5 Thermal Information
LM5117, LM5117-Q1
THERMAL METRIC
(1)
PWP (HTSSOP) RTW (WQFN) UNIT
20 PINS 24 PINS
R
θJA
Junction-to-ambient thermal resistance 40 40 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 4 6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: LM5117 LM5117-Q1
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