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LM5575MH/NOPB 数据手册 - National Semiconductor(美国国家半导体)
制造商:
National Semiconductor(美国国家半导体)
封装:
eTSSOP-16
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P2P3Hot
典型应用电路图在P8
原理图在P1P8P10
封装尺寸在P23P25P26P27
焊盘布局在P28
标记信息在P23P24
封装信息在P23P24P25P26
技术参数、封装参数在P3P4P5P9
应用领域在P1
电气规格在P3P4P5P6P7
导航目录
LM5575MH/NOPB数据手册
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LM5575
www.ti.com
SNVS471G –JANUARY 2007–REVISED APRIL 2013
Electrical Characteristics (continued)
Specifications with standard typeface are for T
J
= 25°C, and those with boldface type apply over full Operating Junction
Temperature range. V
IN
= 48V, R
T
= 32.4kΩ unless otherwise stated.
(1)
Symbol Parameter Conditions Min Typ Max Units
ERROR AMPLIFIER
Feedback Voltage Vfb = COMP 1.207 1.225 1.243 V
FB Bias Current 17 nA
DC Gain 70 dB
COMP Sink / Source Current 3 mA
Unity Gain Bandwidth 3 MHz
DIODE SENSE RESISTANCE
D
SENSE
83 mΩ
THERMAL SHUTDOWN
Tsd Thermal Shutdown Threshold 165 °C
Thermal Shutdown Hysteresis 25 °C
THERMAL RESISTANCE
θ
JC
Junction to Case 14 °C/W
θ
JA
Junction to Ambient 50 °C/W
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