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LME49710NA/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
PDIP-8
描述:
Texas InstrumentsTexas Instruments 系列运算放大器设计用于高保真音频应用。 设备通常具有低失真和噪声级别，及高转换速率和宽带宽。 它们可在宽电源电压范围内频繁操作，且包括可驱动 600 Ω 负载的输出。### 运算放大器，Texas Instruments
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典型应用电路图在P2P19
封装尺寸在P27P29P30
标记信息在P27
封装信息在P27P28P29P30
技术参数、封装参数在P1P3
应用领域在P1P19P34
电气规格在P3P4P5P6P7P8P9P10P11P12P13P14
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LME49710NA/NOPB数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LME49710HA/NOPB ACTIVE TO-99 LMC 8 20 Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM -40 to 85
LME49710MA/NOPB LIFEBUY SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 L49710
MA
LME49710MAX/NOPB NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 L49710
MA
LME49710NA/NOPB NRND PDIP P 8 40 Green (RoHS
& no Sb/Br)
CU SN Level-1-NA-UNLIM -40 to 85 LME
49710NA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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