器件3D模型

￥ 18.444

LMH6643MM/NOPB 数据手册 - TI（德州仪器）

制造商:

TI（德州仪器）

分类:

运算放大器

封装:

MSOP-8

描述:

Texas Instruments

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

引脚图在P4Hot

典型应用电路图在P22P23P24

原理图在P21

封装尺寸在P27P29P30

标记信息在P27P28

封装信息在P26P27P28P29P30

焊接温度在P5

技术参数、封装参数在P5P21P23

应用领域在P1P39

电气规格在P5P6P7P8P9P10P11P12P13P14P15P16

导航目录

引脚图在P4
典型应用电路图在P22 P23 P24
原理图在P21
封装尺寸在P27 P29 P30
标记信息在P27 P28
封装信息在P26 P27 P28 P29 P30
焊接温度在P5
技术参数、封装参数在P5 P21 P23
应用领域在P1 P39
电气规格在P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 P16

LMH6643MM/NOPB数据手册

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PACKAGE OPTION ADDENDUM

www.ti.com

5-May-2016

Addendum-Page 2

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.