Datasheet 搜索 > 稳压芯片 > TI（德州仪器） > LP2951CMX-3.0/NOPB 数据手册 > LP2951CMX-3.0/NOPB 数据手册 32/51 页
器件3D模型￥ 5.444
LP2951CMX-3.0/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
SOIC-8
描述:
LP2950 -N / LP2951 -N系列的可调微功耗电压调节器 LP2950-N/LP2951-N Series of Adjustable Micropower Voltage Regulators
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P19
原理图在P1P15P18
封装尺寸在P34P35P36P37P39P40P41P42
标记信息在P34P35P36P37P38
封装信息在P6P33P34P35P36P37P38P39P40P41P42
技术参数、封装参数在P4P5P7
应用领域在P1P19P20P51
电气规格在P6P7P8
导航目录
LP2951CMX-3.0/NOPB数据手册
Page:
of 51 Go
若手册格式错乱，请下载阅览PDF原文件
LP2950-N
,
LP2951-N
SNVS764O –JANUARY 2000–REVISED DECEMBER 2014
www.ti.com
WSON Mounting (continued)
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a
parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that
the DAP be connected directly to the ground at device lead 4 (that is, GND). Alternately, but not recommended,
the DAP may be left floating (that is, no electrical connection). The DAP must not be connected to any potential
other than ground.
32 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LP2950-N LP2951-N
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