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LP2998QMR/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
HSOP-8
描述:
专业电源管理 (PMIC) DDR-I & DDR-II Termination Reg
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P15P16P17P18P19
原理图在P1P11
封装尺寸在P23P25P26
焊盘布局在P21
标记信息在P23P24
封装信息在P22P23P24P25P26
技术参数、封装参数在P5
应用领域在P1P15P16P19P31
电气规格在P3P6P7
导航目录
LP2998QMR/NOPB数据手册
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V
TT
LP2998
PV
IN
V
DDQ
V
REF
AV
IN
V
REF
=
0.75V
V
SENSE
GND
+
+
+
V
DDQ
=
1.5V
V
DD
=
2.5V
V
TT
=
0.75V
SD
SD
C
IN
C
OUT
C
REF
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LP2998
,
LP2998-Q1
SNVS521K –DECEMBER 2007–REVISED AUGUST 2014
LP2998/LP2998-Q1 DDR Termination Regulator
1 Features 3 Description
The LP2998 linear regulator is designed to meet
1
• AEC-Q100 Test Guidance with the following
JEDEC SSTL-2 and JEDEC SSTL-18 specifications
results (SO PowerPAD-8):
for termination of DDR-SDRAM and DDR2 memory.
– Device HBM ESD Classification Level H1C
The device also supports DDR3 and DDR3L VTT bus
– Junction Temperature Range –40°C to 125°C
termination with V
DDQ
min of 1.35 V. The device
contains a high-speed operational amplifier to provide
• 1.35 V Minimum V
DDQ
excellent response to load transients. The output
• Source and Sink Current
stage prevents shoot through while delivering 1.5 A
• Low Output Voltage Offset
continuous current and transient peaks up to 3 A in
the application as required for DDR-SDRAM
• No External Resistors Required
termination. The LP2998 also incorporates a
• Linear Topology
VSENSE pin to provide superior load regulation and
• Suspend to Ram (STR) Functionality
a V
REF
output as a reference for the chipset and
DIMMs.
• Low External Component Count
• Thermal Shutdown
An additional feature found on the LP2998 is an
active low shutdown (SD) pin that provides Suspend
2 Applications
To RAM (STR) functionality. When SD is pulled low
the V
TT
output will tri-state providing a high
• DDR1, DDR2, DDR3, and DDR3L Termination
impedance output, but, V
REF
will remain active. A
Voltage
power savings advantage can be obtained in this
• Automotive Infotainment
mode through lower quiescent current.
• FPGA
Device Information
(1)
• Industrial/Medical PC
PART NUMBER PACKAGE BODY SIZE (NOM)
• SSTL-18, SSTL-2, and SSTL-3 Termination
LP2998 SO PowerPAD™ (8) 4.89 mm x 3.90 mm
• HSTL Termination
LP2998 SOIC (8) 4.90 mm x 3.91 mm
LP2998-Q1 SO PowerPAD™ (8) 4.89 mm x 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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