Datasheet 搜索 > 稳压芯片 > Linear Technology（凌力尔特） > LT3752HFE#TRPBF 数据手册 > LT3752HFE#TRPBF 数据手册 50/52 页
器件3D模型￥ 39.196
LT3752HFE#TRPBF 数据手册 - Linear Technology（凌力尔特）
制造商:
Linear Technology（凌力尔特）
分类:
稳压芯片
封装:
TFSOP-38
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P13P14Hot
典型应用电路图在P1P27P33P44P45P46P47P48P49P52
原理图在P15P19P24P25
焊盘布局在P50
技术参数、封装参数在P8
应用领域在P1P8P21P22P23P24P25P26P27P28P29P30
电气规格在P4P5P6P7P8P9P10P11P12P13P24P30
导航目录
LT3752HFE#TRPBF数据手册
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若手册格式错乱，请下载阅览PDF原文件
LT3752/LT3752-1
50
3752fb
For more information www.linear.com/LT3752
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.75
(.187)
REF
FE38 (AB) TSSOP REV B 0910
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1
19
PIN NUMBERS 23, 25, 27, 29, 31, 33 AND 35 ARE REMOVED
20
REF
9.60 – 9.80*
(.378 – .386)
38
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.50
(.0196)
BSC
0.17 – 0.27
(.0067 – .0106)
TYP
RECOMMENDED SOLDER PAD LAYOUT
0.315 ±0.05
0.50 BSC
4.50 REF
6.60 ±0.10
1.05 ±0.10
4.75 REF
2.74 REF
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
Package Variation: FE38 (31)
38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1665 Rev B)
Exposed Pad Variation AB
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