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器件3D模型￥ 24.454
LTC3736EGN-1#PBF 数据手册 - ADI（亚德诺）
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ADI（亚德诺）
封装:
SSOP
描述:
降压型 2.75V~9.8V 750kHz
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LTC3736EGN-1#PBF数据手册
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26
LTC3736-1
37361f
U
PACKAGE DESCRIPTIO
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.38 ± 0.10
24
0.23 TYP
(4 SIDES)
23
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 1103
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ± 0.05
(4 SIDES)
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
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