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LTC4364HS-2#PBF 数据手册 - ADI(亚德诺)
制造商:
ADI(亚德诺)
封装:
SOP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P7P8Hot
典型应用电路图在P1P19P20P21P24
原理图在P9
封装尺寸在P21
焊盘布局在P22P23
型号编码规则在P3
标记信息在P3
封装信息在P3
技术参数、封装参数在P4
应用领域在P1P7P8P11P12P13P14P15P16P17P18P19
电气规格在P3P4P5P6P12
导航目录
LTC4364HS-2#PBF数据手册
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LTC4364-1/LTC4364-2
22
436412f
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)
MSOP (MS16) 1107 REV Ø
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
161514131211 10
1 2 3 4 5 6 7 8
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
4.039 ± 0.102
(.159 ± .004)
(NOTE 3)
0.1016 ± 0.0508
(.004 ± .002)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.280 ± 0.076
(.011 ± .003)
REF
4.90 ± 0.152
(.193 ± .006)
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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