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LTC6992IS6-2#TRPBF 数据手册 - ADI（亚德诺）
制造商:
ADI（亚德诺）
封装:
SOT-23
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P33Hot
典型应用电路图在P33
原理图在P33
封装尺寸在P3P31
焊盘布局在P32
型号编码规则在P33
标记信息在P3
封装信息在P3
技术参数、封装参数在P5
应用领域在P19P33
电气规格在P33
导航目录
LTC6992IS6-2#TRPBF数据手册
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若手册格式错乱，请下载阅览PDF原文件
LTC6992-1/LTC6992-2/
LTC6992-3/LTC6992-4
31
69921234fc
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715 Rev A)
package DescripTion
3.00 ±0.10
(2 SIDES)
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 ±0.10
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DCB6) DFN 0405
0.25 ± 0.05
0.50 BSC
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
0.25 ± 0.05
1.35 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.50 BSC
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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