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M24C32-RMB6TG 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
EEPROM芯片
封装:
UFDFPN-8
描述:
M24C32 Series 32 Kb (4 K x 8) 1.8 V SMT Serial I睠 Bus EEPROM - MLP-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P6
原理图在P10
封装尺寸在P34P35P36P37P38P39P40P41P42P43P44
型号编码规则在P45P46P47
标记信息在P7
封装信息在P45
技术参数、封装参数在P23
导航目录
M24C32-RMB6TG数据手册
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若手册格式错乱，请下载阅览PDF原文件
This is information on a product in full production.
July 2017 DocID4578 Rev 29 1/50
M24C32-W M24C32-R M24C32-F
M24C32-X M24C32-DF
32-Kbit serial I²C bus EEPROM
Datasheet - production data
PDIP8 (BN)
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
UFDFPN8
(MC)
UFDFPN5
(MH)
Unsawn wafer
WLCSP
(CU)
Features
• Compatible with all I
2
C bus modes:
–1 MHz
– 400 kHz
– 100 kHz
• Memory array:
– 32 Kbit (4 Kbyte) of EEPROM
– Page size: 32 byte
– Additional Write lockable page (M24C32-D
order codes)
• Single supply voltage:
– 1.7 V to 5.5 V over –40 °C / +85 °C
– 1.6 V to 5.5 V over –20 °C / +85 °C
• Write:
– Byte Write within 5 ms
– Page Write within 5 ms
• Random and sequential Read modes
• Write protect of the whole memory array
• Enhanced ESD/Latch-Up protection
• More than 4 million Write cycles
• More than 200-years data retention
Packages
• PDIP8 ECOPACK2
®
• SO8 ECOPACK2
®
• TSSOP8 ECOPACK2
®
• UFDFPN8 ECOPACK2
®
• WLCSP ECOPACK2
®
• UFDFPN5 ECOPACK2
®
• Unsawn wafer (each die is tested)
www.st.com
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