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MC14094BCP
器件3D模型
6.345
导航目录
  • 引脚图在P2
  • 原理图在P5
  • 封装尺寸在P7P8P9
  • 焊盘布局在P7P8
  • 型号编码规则在P1P2P9
  • 标记信息在P1P9
  • 封装信息在P2
  • 技术参数、封装参数在P2
  • 应用领域在P1P2
  • 电气规格在P3
  • 型号编号列表在P1
MC14094BCP数据手册
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of 9 Go
若手册格式错乱,请下载阅览PDF原文件
MC14094B
http://onsemi.com
2
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q7
Q6
Q5
OUTPUT
ENABLE
V
DD
Q
S
Q
S
Q8
Q1
CLOCK
DATA
STROBE
V
SS
Q4
Q3
Q2
PIN ASSIGNMENT
TRUTH TABLE
Clock
Outpu
t
Enable
Strobe Data
Parallel Outputs Serial Outputs
Q1 Q
N
Q
S
* Q
S
0 X X Z Z Q7 No Chg.
0 X X Z Z No Chg. Q7
1 0 X No Chg. No Chg. Q7 No Chg.
1 1 0 0 Q
N
−1 Q7 No Chg.
1 1 1 1 Q
N
−1 Q7 No Chg.
1 1 1 No Chg. No Chg. No Chg. Q7
Z = High Impedance X = Don’t Care
* At the positive clock edge, information in the 7th shift register stage is transferred to Q8 and Q
S
.
ORDERING INFORMATION
Device Package Shipping
MC14094BDG SOIC−16
(Pb−Free)
48 Units / Rail
MC14094BDR2G SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
NLV14094BDR2G* SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
MC14094BDTR2G TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
NLV14094BDTR2G* TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
MC14094BFELG SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.

MC14094BCP 数据手册

ON Semiconductor(安森美)
9 页 / 0.12 MByte
ON Semiconductor(安森美)
8 页 / 0.11 MByte

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