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MC14504BDR2G
器件3D模型
1.301
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  • 引脚图在P1
  • 典型应用电路图在P2
  • 封装尺寸在P5P6P7
  • 焊盘布局在P5P6
  • 型号编码规则在P1P2P7
  • 标记信息在P1P7
  • 封装信息在P2
  • 技术参数、封装参数在P2
  • 应用领域在P1P2
  • 电气规格在P3
  • 型号编号列表在P1
MC14504BDR2G数据手册
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MC14504B
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X

MC14504BDR2G 数据手册

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MC14504BDR2 数据手册

ON Semiconductor(安森美)
十六进制电平转换为TTL到CMOS或CMOS至CMOS Hex Level Shifter for TTL to CMOS or CMOS to CMOS
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ON Semiconductor(安森美)
ON SEMICONDUCTOR  MC14504BDR2G.  芯片, 逻辑电平转换器, 六路, SOIC-16, 整卷
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