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MC78L05ACPRAG 数据手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
稳压芯片
封装:
TO-92-3
描述:
ON SEMICONDUCTOR MC78L05ACPRAG 线性稳压器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P1Hot
原理图在P1
封装尺寸在P13P14P15
焊盘布局在P13
型号编码规则在P1P9P10P11P12P15
标记信息在P1P12P15
封装信息在P9P10P11P12
技术参数、封装参数在P2
应用领域在P1P8P9P10P11P12
电气规格在P3P4P5P6
型号编号列表在P2
导航目录
MC78L05ACPRAG数据手册
Page:
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© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 17
1 Publication Order Number:
MC78L00A/D
MC78L00A Series,
NCV78L00A
100 mA Positive Voltage
Regulators
The MC78L00A Series of positive voltage regulators are
inexpensive, easy−to−use devices suitable for a multitude of
applications that require a regulated supply of up to 100 mA. Like
their higher powered MC7800 and MC78M00 Series cousins, these
regulators feature internal current limiting and thermal shutdown
making them remarkably rugged. No external components are
required with the MC78L00 devices in many applications.
These devices offer a substantial performance advantage over the
traditional zener diode−resistor combination, as output impedance
and quiescent current are substantially reduced.
Features
• Wide Range of Available, Fixed Output Voltages
• Low Cost
• Internal Short Circuit Current Limiting
• Internal Thermal Overload Protection
• No External Components Required
• Complementary Negative Regulators Offered (MC79L00A Series)
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
Figure 1. Representative Schematic Diagram
15k
Q1
Q3
Q5
Input
Output
Ground
Q11
Q12
3.0
0-25k
2.85k
5.0k
Q10
3.8k
Q4 Q6
1.2k
1.9k 19k 2.2k
Q9
Q8
C
Q7
1.0k
420
Z1
Q2
TO−92
P SUFFIX
CASE 029
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
Pin: 1. Output
2. Ground
3. Input
PIN CONNECTIONS
18
7
6
5
2
3
4
(Top View)
V
OUT
GND
GND
V
IN
GND
NC
GND
NC
SOIC−8*
D SUFFIX
CASE 751
*SOIC−8 is an internally modified SO−8 package. Pin
s
2, 3, 6, and 7 are electrically common to the die attach
flag. This internal lead frame modification decrease
s
package thermal resistance and increases powe
r
dissipation capability when appropriately mounted on
a printed circuit board. SOIC−8 conforms to all ex
-
ternal dimensions of the standard SO−8 package.
See general marking information in the device marking
section on page 12 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
1
2
3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
SOT−89
CASE 528AG
123
V
OUT
GND V
IN
TAB
(Top View)
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